SEMICONDUCTOR LASER DIODE
To provide a semiconductor laser capable of selectively amplifying or suppressing an individual laser mode in an active region.SOLUTION: With semiconductor laser, a semiconductor laminate 2 is provided with an active layer having a main extension plane and configured to generate light in an active r...
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Main Authors | , , , |
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Format | Patent |
Language | English Japanese |
Published |
25.11.2021
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a semiconductor laser capable of selectively amplifying or suppressing an individual laser mode in an active region.SOLUTION: With semiconductor laser, a semiconductor laminate 2 is provided with an active layer having a main extension plane and configured to generate light in an active region in an operation and to emit light via a light extraction surface. The active region extends from an opposite side rear surface of the light extraction surface along a longitudinal direction in the main extension plane to the light extraction surface. The semiconductor laminate 2 has a front surface area 20. The front surface area 20 is provided with a continuous contact structure 4 in a direct contact state. The contact structure 4 has a first electrical contact material in direct contact with the front surface area 20 at least in a first contact area 241, and a second electrical contact material in direct contact with the front surface region 20 at least in a second contact region 242. The first contact region 241 and the second contact region 242 are in contact with each other.SELECTED DRAWING: Figure 1C
【課題】活性領域において個々のレーザモードを選択的に増幅または抑制できる半導体レーザーを提供する。【解決手段】主伸長平面を有し、動作時に活性領域において光を発生するように、かつ光取出し面を介して光を放射するように構成された活性層を有する半導体積層体2を備え、活性領域は、主伸長平面において長手方向に沿って光取出し面の反対側の後面から光取出し面まで伸長し、半導体積層体2は、表面領域20を有し、表面領域20には、連続的なコンタクト構造4が直接接触した状態で設けられ、コンタクト構造4は、表面領域20に直接接触している第1の電気コンタクト材料を少なくとも第1のコンタクト領域241に有し、かつ、表面領域20に直接接触している第2の電気コンタクト材料を少なくとも第2のコンタクト領域242に有し、第1のコンタクト領域241および第2のコンタクト領域242は、互いに接している、半導体レーザーを特定する。【選択図】図1C |
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Bibliography: | Application Number: JP20210128291 |