WIRING BOARD

• Main Authors: TAMURA REI, TANI YOSHIFUMI, KAWAMOTO RYUSHI
• Format: Patent
• Language: English; Japanese
• Published: 25.11.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a wiring board having excellent reliability that is strong in adhesion of conductive wiring at a bond part.SOLUTION: In a wiring board, a first conductive wiring and a second conductive wiring are layered from a board side of the wiring board. In the first conductive wiring, from the board side, a first lower conductive oxide layer, a first metal wiring layer, and a first upper conductive oxide layer are layered in this order. In the second conductive wiring, from the board side, a second lower conductive oxide layer, a second metal wiring layer, and a second upper conductive oxide layer are layered in this order. A sum of thickness of the first upper conductive oxide layer, thickness of the second lower conductive oxide layer, and thickness of the second upper conductive oxide layer is equal to or greater than 70 nm and below 130 nm.SELECTED DRAWING: Figure 2 【課題】接合部分での導電配線の密着性が強い良好な信頼性を有する配線基板を得る。【解決手段】配線基板の基板側から第１の導電配線、第２の導電配線が積層されてあり、前記第１の導電配線は前記基板側から、第１の下側導電性酸化物層、第１の金属配線層、および第１の上側導電性酸化物層の順に積層され、前記第２の導電配線は前記基板側から、第２の下側導電性酸化物層、第２の金属配線層、および第２の上側導電性酸化物層の順に積層され、第１の上側導電性酸化物層の厚さと、第２の下側導電性酸化物層の厚さと第２の上側導電性酸化物層の厚さの和を７０ｎｍ以上１３０ｎｍ未満にした構成を持つ配線基板を用いる。【選択図】図２