BARREL POLISHING DEVICE

To provide a centrifugal barrel type barrel polishing device which is capable of performing sun-and-planet motion, allows a user to set and adjust motion conditions of the sun-and-planet motion optionally, and can flexibly deal with workpieces to be processed and meet demands of the user.SOLUTION: I...

Full description

Saved in:
Bibliographic Details
Main Author OCHIAI YOSHITAKA
Format Patent
LanguageEnglish
Japanese
Published 11.11.2021
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:To provide a centrifugal barrel type barrel polishing device which is capable of performing sun-and-planet motion, allows a user to set and adjust motion conditions of the sun-and-planet motion optionally, and can flexibly deal with workpieces to be processed and meet demands of the user.SOLUTION: In a barrel polishing device, a barrel tank 1, which is filled with workpieces W and an abrasive material G, revolves in a horizontal direction to apply centrifugal force to the workpieces W and the abrasive material G in the barrel tank 1 and cause the workpieces W and the abrasive material G to rub against each other thereby polishing the workpieces W. The barrel tank 1 provided in a state that its axis X is inclined relative to a vertical revolution axis X0 revolves around the revolution axis X0 horizontally at a predetermined revolution speed and autorotates around a vertical axis at a predetermined slow autorotation speed, which is substantially slower than the revolution speed, or stops. A speed ratio of the autorotation speed to the revolution speed can be variably adjusted.SELECTED DRAWING: Figure 5 【課題】遊星運動をする遠心バレル方式のバレル研磨装置において、遊星運動の運動条件を任意に設定調整することができ、処理対象となるワークや使用者の要望に柔軟に応じられるバレル研磨装置を提供する。【解決手段】ワークWと研磨材Gが充填収容されたバレル槽1が水平方向に公転することにより、バレル槽1内のワークWと研磨材Gに遠心力が与えられて、これらワークWと研磨材Gの擦れ合いによりワークWを研磨するバレル研磨装置であって、垂直な公転軸X0に対して、軸線Xを傾斜した状態で設けられたバレル槽1が、公転軸X0まわりに所定の公転速度をもって水平に公転されるとともに、この公転速度よりも大幅に減速されたゆっくりした所定の自転速度をもって垂直軸まわりに自転または停止する構成とされ、上記自転速度の上記公転速度に対する速度比が可変調整可能とされている。【選択図】図5
Bibliography:Application Number: JP20200082914