CERAMIC SUBSTRATE AND ELECTRONIC COMPONENT BUILT-IN MODULE

• Main Authors: MATSUSHITA YOSUKE, ASAI RYOTA
• Format: Patent
• Language: English; Japanese
• Published: 04.11.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a ceramic substrate which suppresses coating of a glass component on a surface electrode and has high adhesion to sealing resin in an electronic component built-in module.SOLUTION: A ceramic substrate 1 includes a ceramic body 10 having a ceramic layer 11 on a surface thereof and a surface electrode 20 disposed on a primary face of the ceramic body 10. Between the surface electrode 20 and the ceramic layer 11, an oxide layer 31 made of insulating oxide having a melting point higher than firing temperature for the ceramic layer 11 is disposed. In the ceramic substrate 1, an oxide layer 32 also is disposed on the ceramic layer 11 not provided with the surface electrode 20. A surface of the oxide layer 32 on the ceramic layer 11 not provided with the surface electrode 20 is a rough surface.SELECTED DRAWING: Figure 1 【課題】表面電極上へのガラス成分の被覆が抑制されるとともに、電子部品内蔵モジュールにおける封止樹脂との密着性が高いセラミック基板を提供すること。【解決手段】表面にセラミック層１１を有するセラミック素体１０と、セラミック素体１０の一方主面に設けられた表面電極２０とを備えるセラミック基板１であって、表面電極２０とセラミック層１１との間に、セラミック層１１の焼成温度よりも高い融点を有する絶縁性の酸化物からなる酸化物層３１が設けられているとともに、表面電極２０が設けられていないセラミック層１１上にも酸化物層３２が設けられており、表面電極２０が設けられていないセラミック層１１上の酸化物層３２の表面が粗面であることを特徴とするセラミック基板１。【選択図】図１