AROMATIC UNDERLAYER
To provide, in the field of manufacturing electronic devices, materials useful for curing and forming underlayers in semiconductor manufacturing processes at lower temperatures, and a patterning method.SOLUTION: A method comprises:; forming an underlayer by curing a layer of a coating composition co...
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Main Authors | , , , , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
04.11.2021
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Subjects | |
Online Access | Get full text |
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Summary: | To provide, in the field of manufacturing electronic devices, materials useful for curing and forming underlayers in semiconductor manufacturing processes at lower temperatures, and a patterning method.SOLUTION: A method comprises:; forming an underlayer by curing a layer of a coating composition containing a curable compound, where the curable compound comprises three or more substituents represented by a specific formula and an aromatic core selected from a C5-6 aromatic ring and a C9-30 fused aromatic ring system; coating the underlayer with a layer of a photoresist; exposing the photoresist layer to actinic radiation through a mask; developing the exposed photoresist layer to form a resist pattern; and transferring the pattern to the underlayer to expose multiple portions of an electronic device substrate.SELECTED DRAWING: None
【課題】電子デバイスを製造する分野に関し、半導体製造プロセスにおける下層を、より低い温度で硬化形成するために有用である材料、およびパターン形成方法を提供する。【解決手段】C5−6芳香環及びC9−30縮合芳香環系から選択される芳香族コア、並びに特定の式で表される3個以上の置換基を含む硬化性化合物を含有するコーティング組成物層を硬化させて下層を形成する工程と、フォトレジストの層を下層上にコートする工程と、マスクを通してフォトレジスト層を化学線に露光する工程と、露光されたフォトレジスト層を現像してレジストパターンを形成する工程と、パターンを下層に転写して電子デバイス基板の複数部分を露出させる工程、とを含む方法。【選択図】なし |
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Bibliography: | Application Number: JP20210077391 |