COATING COMPOSITION AND METHOD OF FORMING ELECTRONIC DEVICE

• Main Authors: SUZANNE M COLEY, WANG DEYAN, LIU SHENG, YAMADA SHINTARO, KE IOU-SHENG, PAUL J LABEAUME, CUI LI, JAMES F CAMERON, KEREN ZHANG
• Format: Patent
• Language: English; Japanese
• Published: 04.11.2021
• Subjects: ADHESIVES; APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; CINEMATOGRAPHY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; FILLING PASTES; HOLOGRAPHY; INKS; MATERIALS THEREFOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORIGINALS THEREFOR; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS THEREFOR; WOODSTAINS

To provide coating compositions, and to provide methods of forming electronic devices.SOLUTION: Coating compositions comprise: a curable compound comprising a core chosen from a C6 carbocyclic aromatic ring, a C2-5 heterocyclic aromatic ring, a C9-30 fused carbocyclic aromatic ring system, a C4-30 fused heterocyclic aromatic ring system, C1-20 aliphatic, and C3-20 cycloaliphatic, and a substituent comprising three or more triple bonds, provided that no substituents are in an ortho position to each other on the same aromatic ring of the core; a polymer; and one or more solvent (wherein a total solvent content is from 50 to 99 wt.% based on the coating composition). Coated substrates formed with the coating compositions and methods of forming electronic devices using the compositions are also provided. The coating compositions, coated substrates and methods find particular applicability in the manufacture of semiconductor devices.SELECTED DRAWING: None 【課題】コーティング組成物及び電子デバイスを形成する方法を提供する。【解決手段】コーティング組成物は、Ｃ６炭素環式芳香環、Ｃ２〜５複素環式芳香環、Ｃ９〜３０縮合炭素環式芳香環系、Ｃ４〜３０縮合複素環式芳香環系、Ｃ１〜２０脂肪族、及びＣ３〜２０脂環式から選択されるコアと、３つ以上の三重結合を含み、コアの同じ芳香環にて互いにオルト位にないことを条件とする、置換基とを含む硬化性化合物と、ポリマーと、１つ以上の溶媒（この場合、総溶媒含有量は、コーティング組成物に基づいて５０〜９９重量％である）と、を含む。また、コーティング組成物で形成されたコーティングされた基板、及びコーティング組成物を使用して電子デバイスを形成する方法が提供される。コーティング組成物、コーティングされた基板、及び方法は、半導体デバイスの製造において特定の適用性を見出す。【選択図】なし