PACKAGE FOR STORING ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

• Main Author: ONIZUKA YOSHITOMO
• Format: Patent
• Language: English; Japanese
• Published: 01.11.2021
• Subjects: BASIC ELECTRIC ELEMENTS; BASIC ELECTRONIC CIRCUITRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS; SEMICONDUCTOR DEVICES

To reduce a situation in which a short circuit occurs between connection conductors in connecting an electronic component to the connection conductors with a joint material, even though the distance between the connection conductors is reduced.SOLUTION: In an electronic module 300, a package for storing an electronic component 100 has: a base part 102 that includes a first surface 104 on which an electronic component 112 is mounted and a second surface 105 located opposite to the first surface 104; a side part 106 that extends, from the base part 102, in a first direction directed from the second surface 105 to the first surface 104; a cavity 107 that is surrounded by the first surface 104 and the side part 106; and a first connection conductor 109a and a second connection conductor 109b that are located on the first surface 104 in the cavity 107. The first connection conductor 109a and the second connection conductor 109b are located opposite to each other, and at least one of a first top face 109c of the first connection conductor 109a and a second top face 109d of the second connection conductor 109b has a first inclined part 110 inclined in a direction separating from the opposing portion.SELECTED DRAWING: Figure 2 【課題】接続導体間の距離が小さくなっても、電子部品を接合材により接続導体に接続する際に、接続導体間が短絡することを低減する。【解決手段】電子モジュール３００において、電子部品収納用パッケージ１００は、電子部品１１２が搭載される第１面１０４および第１面１０４の反対に位置する第２面１０５を備える基部１０２と、基部１０２から、第２面１０５から第１面１０４に向かう第１方向に延びる側部１０６と、第１面１０４および側部１０６で囲まれたキャビティ１０７と、キャビティ１０７内における第１面１０４に位置する、第１接続導体１０９ａおよび第２接続導体１０９ｂと、を有する。第１接続導体１０９ａおよび第２接続導体１０９ｂは、対向して位置しており、第１接続導体１０９ａの第１上面１０９ｃおよび第２接続導体１０９ｂの第２上面１０９ｄの少なくともいずれかが、対向部分から離れる方向に傾斜した第１傾斜部１１０を有している。【選択図】図２