METHOD FOR CONTROLLING FLATNESS, METHOD FOR FORMING COATING FILM, APPARATUS FOR CONTROLLING FLATNESS, AND APPARATUS FOR FORMING COATING FILM

• Main Author: OGIWARA TSUTOMU
• Format: Patent
• Language: English; Japanese
• Published: 01.11.2021
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPARATUS SPECIALLY ADAPTED THEREFOR; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

To provide a method for controlling flatness by which the flatness of a wafer can be controlled sufficiently, and an apparatus for controlling flatness that can implement the method.SOLUTION: The present invention discloses a method for controlling flatness of a wafer including the steps of: providing a holding member having a holding surface including a plurality of segments, where each of the plurality of segments includes a dry adhesive fiber structure; causing a wafer to be adsorbed to the holding surface of the holding member to make the holding member hold the wafer; obtaining information on flatness of the wafer by measuring flatness of the wafer; and releasing the adsorbed wafer from the dry adhesive fiber structures in some of the plurality of segments of the holding surface of the holding member based on the information on flatness.SELECTED DRAWING: Figure 2 【課題】ウェーハの平坦性を十分に制御できる平坦性制御方法、及びこの方法を実施できる平坦性制御装置を提供すること。【解決手段】ウェーハの平坦性制御方法であって、複数のセグメントを含む保持面を有し、前記複数のセグメントの各々が乾式接着性繊維構造体を備える保持部材を準備する工程と、前記保持部材の前記保持面にウェーハを吸着させて、前記保持部材に前記ウェーハを保持させる工程と、前記ウェーハの平坦性を測定して、前記ウェーハの平坦性の情報を得る工程と、該平坦性の情報に基づいて、前記保持部材の前記保持面の前記複数のセグメントの一部において、前記ウェーハに対する前記乾式接着性繊維構造体による吸着を開放する工程とを含むことを特徴とする平坦性制御方法。【選択図】図２