COMPOSITION FOR FORMING SILICA FILM, SILICA FILM PRODUCED USING COMPOSITION, AND ELECTRONIC ELEMENT CONTAINING SILICA FILM

• Main Authors: KWAK TAEK-SOO, BAE JIN-HEE, LIM WAN-HEE, JO HYEONSU, HWANG BYEONG-GYU, CHEON HWAN SUNG
• Format: Patent
• Language: English; Japanese
• Published: 28.10.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOUNDS THEREOF; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INORGANIC CHEMISTRY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; NON-METALLIC ELEMENTS; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a composition for forming a silica film capable of providing a silica film having excellent etching resistance.SOLUTION: A composition for forming a silica film includes a silicon-containing polymer and a solvent, and the weight average molecular weight (Mw) of the silicon-containing polymer is 8,000 to 15,000 g/mol, and the nitrogen content in the silicon-containing polymer measured by the Kjeldahl method is 25 to 30 weight% using the total weight of the silicon-containing polymer as a standard.SELECTED DRAWING: None 【課題】耐エッチング性に優れたシリカ膜を提供することができるシリカ膜形成用組成物を提供する。【解決手段】ケイ素含有重合体、および溶媒を含み、前記ケイ素含有重合体の重量平均分子量（Ｍｗ）は、８，０００〜１５，０００ｇ／ｍｏｌであり、ケルダール法で測定される前記ケイ素含有重合体中の窒素含有量が、前記ケイ素含有重合体の総重量を基準として２５〜３０重量％である、シリカ膜形成用組成物。【選択図】なし