PRODUCTION METHOD FOR WAFER

• Main Author: NOMARU KEIJI
• Format: Patent
• Language: English; Japanese
• Published: 21.10.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; CUTTING-OUT; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HAND CUTTING TOOLS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORATING; PERFORMING OPERATIONS; PUNCHING; SEMICONDUCTOR DEVICES; SEVERING; SEVERING BY MEANS OTHER THAN CUTTING; SOLDERING OR UNSOLDERING; STAMPING-OUT; TRANSPORTING; WELDING; WORKING BY LASER BEAM; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

To provide a production method for a wafer, which can efficiently produce the wafer from an ingot to reduce a discarded amount.SOLUTION: In a production method for a wafer according to the present invention, a wafer W is produced from ingot 20 comprising a top surface 20a, an undersurface 20b, and a...