PRODUCTION METHOD FOR WAFER

• Main Author: NOMARU KEIJI
• Format: Patent
• Language: English; Japanese
• Published: 21.10.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; CUTTING-OUT; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HAND CUTTING TOOLS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORATING; PERFORMING OPERATIONS; PUNCHING; SEMICONDUCTOR DEVICES; SEVERING; SEVERING BY MEANS OTHER THAN CUTTING; SOLDERING OR UNSOLDERING; STAMPING-OUT; TRANSPORTING; WELDING; WORKING BY LASER BEAM; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

To provide a production method for a wafer, which can efficiently produce the wafer from an ingot to reduce a discarded amount.SOLUTION: In a production method for a wafer according to the present invention, a wafer W is produced from ingot 20 comprising a top surface 20a, an undersurface 20b, and a side surface 20c. The production method for the wafer includes: a modified layer formation step of forming a modified layer 100 around the entire perimeter of the side surface 20c or in an arc shape by irradiating the ingot 20 with a laser beam LB1 with a wavelength having permeability in such a manner that a light concentration point of the laser beam is positioned on the inside from the side surface 20c in a position corresponding to the thickness of the wafer to be produced; a separating layer formation step of forming separating layers 120 and 130 by applying an external force from the top surface 20a of the ingot 20 and concentrating stress on a crack C1 extended inward from the modifying layer 100 so as to make the crack C1 progress inward from the side of the side surface 20c; and a wafer production step of producing the wafer by separating the wafer W to be produced from the ingot 20 in such a manner that the separating layers 120 and 130 serve as starting points.SELECTED DRAWING: Figure 4 【課題】インゴットからウエーハを効率よく生成し、捨てられる量を軽減することができるウエーハの生成方法を提供する。【解決手段】本発明によれば、上面２０ａと、下面２０ｂと、側面２０ｃとを備えたインゴット２０からウエーハＷを生成するウエーハの生成方法であって、インゴット２０に対して透過性を有する波長のレーザー光線ＬＢ１の集光点を、生成すべきウエーハの厚みに相当する位置の側面２０ｃから内部に位置付けて照射して改質層１００を側面２０ｃの全周にわたって、又は円弧状に形成する改質層形成工程と、インゴット２０の上面２０ａから外力を付与して改質層１００から内部に延びる亀裂Ｃ１に応力を集中させ亀裂Ｃ１を側面２０ｃ側から内部に向かって進展させて剥離層１２０、１３０を形成する剥離層形成工程と、剥離層１２０、１３０を起点として生成すべきウエーハＷをインゴット２０から剥離してウエーハを生成するウエーハ生成工程と、を含み構成されるウエーハの生成方法が提供される。【選択図】図４