SUBSTRATE PROCESSING APPARATUS

• Main Authors: KAMIYA MASAYA, NAKAMURA MINAMI, DEMURA KENSUKE, HATTORI KEI, MATSUSHIMA DAISUKE
• Format: Patent
• Language: English; Japanese
• Published: 21.10.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a substrate processing apparatus capable of suppressing liquid before freezing from being discharged from the peripheral edge of a substrate.SOLUTION: A substrate processing apparatus according to an embodiment includes a mount that can support a substrate, a cooling unit capable of supplying cooling gas to a space between the mount and the substrate, a liquid supply unit capable of supplying liquid to the surface of the substrate opposite to the mount side, a plate that has a plate shape and surrounds the periphery of the substrate, and a liquid-repellent unit provided at least on the surface of the plate opposite to the mount side and having a property of repelling the liquid more easily than the substrate.SELECTED DRAWING: Figure 4 【課題】凍結前の液体が基板の周縁から排出されるのを抑制することができる基板処理装置を提供することである。【解決手段】実施形態に係る基板処理装置は、基板を支持可能な載置台と、前記載置台と、前記基板と、の間の空間に、冷却ガスを供給可能な冷却部と、前記基板の、前記載置台側とは反対側の面に液体を供給可能な液体供給部と、板状を呈し、前記基板の周縁を囲むプレートと、少なくとも、前記プレートの、前記載置台側とは反対側の面に設けられ、前記基板よりも前記液体をはじきやすい性質を有する撥液部と、を備えている。【選択図】図４