ADHESIVE TAPE

• Main Authors: SATO NOBUYUKI, ABE NORIAKI
• Format: Patent
• Language: English; Japanese
• Published: 11.10.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

To provide an adhesive tape which is excellent in wire connection reliability after a wire bonding step.SOLUTION: An adhesive tape has an adhesive layer containing a phenoxy resin, an acid anhydride, and an epoxy resin.SELECTED DRAWING: None 【課題】 ワイヤボンディング工程後のワイヤ接続信頼性に優れた粘着テープを提供すること。【解決手段】 フェノキシ樹脂と、酸無水物と、エポキシ樹脂と、を含む粘着層を有する粘着テープ。【選択図】なし