LASER MACHINING APPARATUS

• Main Author: ASAI YASUHIRO
• Format: Patent
• Language: English; Japanese
• Published: 11.10.2021
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PERFORMING OPERATIONS; PHYSICS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a laser machining apparatus that improves the visibility of machining contents drawn by a visible laser beam on an object to be machined.SOLUTION: A laser machining apparatus 1 specifies a moving distance of a scanning position of a visible laser beam in a non-drawing period specified by machining data 44, which is a period during which drawing is not performed by the visible laser beam, based on the machining data 44, and determines a pulse signal for emitting a visible laser beam from a visible semiconductor laser 28 during the non-drawing period as a non-drawing period pulse signal based on the moving distance. In a drawing period during which drawing is performed by the visible laser beam, the laser processing apparatus causes the visible semiconductor laser 28 to emit a visible laser beam based on a drawing period pulse signal preset as a pulse signal, and in the non-drawing period, it causes the visible semiconductor laser 28 to emit a visible laser beam based on the non-drawing period pulse signal.SELECTED DRAWING: Figure 2 【課題】加工対象物上に可視レーザ光で描画される加工内容の視認性を向上させるレーザ加工装置を提供する。【解決手段】レーザ加工装置１は、可視レーザ光による描画を行わない期間であって、加工データ４４により特定される非描画期間における、可視レーザ光の走査位置の移動距離を加工データ４４に基づいて特定し、非描画期間において可視半導体レーザ２８から可視レーザ光を出射させるためのパルス信号を、非描画期間パルス信号として移動距離に基づいて決定し、可視レーザ光による描画を行う描画期間では、パルス信号として予め設定される描画期間パルス信号に基づいて、可視半導体レーザ２８から可視レーザ光を出射させる一方、非描画期間では、非描画期間パルス信号に基づいて、可視半導体レーザ２８から可視レーザ光を出射させる。【選択図】図２