WIRING BOARD, ELECTRONIC DEVICE AND ELECTRONIC MODULE

• Main Authors: HOSOI YOSHIHIRO, TAKESHIMA YUKI
• Format: Patent
• Language: English; Japanese
• Published: 07.10.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To improve the thermal conductivity of the wiring board, and to provide an electronic device and an electronic module using the wiring board.SOLUTION: A wiring board (10) has an insulating substrate (12), a conductor layer (14) located on the insulating substrate, and an intermediate layer (16) located between the insulating substrate and the conductor layer, and the intermediate layer (16) has a mottled portion (31) containing Cu. The electronic device includes a wiring board (10) and electronic components mounted on the wiring board (10). An electronic module includes the electronic device and a module substrate on which the electronic device is mounted.SELECTED DRAWING: Figure 2 【課題】配線基板の熱伝導率を向上させることを目的とする。また、上記の配線基板を用いた電子装置及び電子モジュールを提供する。【解決手段】配線基板（１０）は、絶縁基板（１２）と、絶縁基板上に位置する導体層（１４）と、絶縁基板と導体層との間に位置する中間層（１６）とを備え、中間層（１６）はＣｕを含む斑状部（３１）を有する。電子装置は、配線基板（１０）と、配線基板（１０）に搭載された電子部品とを含む。電子モジュールは、上記の電子装置と、当該電子装置を搭載したモジュール用基板とを含む。【選択図】図２