DIE BONDING DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

To provide a die bonding device capable of further reducing the size of a mechanism in a push-up unit.SOLUTION: A die bonding device includes a push-up unit having a plurality of blocks in contact with a dicing tape and pushing a die from under the dicing tape, a collet that adsorbs the die, and a c...

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Bibliographic Details
Main Authors NAKUI YUKI, SAITO AKIRA, IKARASHI ITSUKI
Format Patent
LanguageEnglish
Japanese
Published 07.10.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a die bonding device capable of further reducing the size of a mechanism in a push-up unit.SOLUTION: A die bonding device includes a push-up unit having a plurality of blocks in contact with a dicing tape and pushing a die from under the dicing tape, a collet that adsorbs the die, and a control unit configured to control the push-up unit. The push-up unit includes a plurality of drive shafts that operate independently corresponding to the plurality of blocks, and a plurality of motors for the plurality of drive shafts. The control unit measures the peeling force of the die by measuring a torque value for each motor.SELECTED DRAWING: Figure 1 【課題】突上げユニット内の機構をより小型化できるダイボンディング装置を提供することにある。【解決手段】ダイボンディング装置は、ダイシングテープと接触する複数のブロックを有し、ダイを前記ダイシングテープの下から突き上げる突上げユニットと、ダイを吸着するコレットと、突上げユニットを制御するよう構成される制御部と、を備える。突上げユニットは、複数の前記ブロックに対応して独立に動作する複数の駆動軸と、複数の駆動軸に対応する複数のモータと、を備え、制御部は前記モータ毎にトルク値を測定することにより前記ダイの剥離力を測定するよう構成される。【選択図】図１
Bibliography:Application Number: JP20200055156