METHOD FOR PRODUCING SILVER POWDER
To provide a method for producing silver powder in which a particle diameter distribution is reduced compared with the conventional one, and, when the silver powder is pasted, and electrode formation is performed, low resistance is achieved without changing the kind of a surface treatment agent.SOLU...
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Main Author | |
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Format | Patent |
Language | English Japanese |
Published |
30.09.2021
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a method for producing silver powder in which a particle diameter distribution is reduced compared with the conventional one, and, when the silver powder is pasted, and electrode formation is performed, low resistance is achieved without changing the kind of a surface treatment agent.SOLUTION: In a silver powder production process, by adding the slurry of silver powder with an O/W type emulsion comprising the micelle of a surface treatment agent having a cumulative 50% particle diameter D50 of 1.5 μm or lower based on volume obtained by a laser diffraction type particle diameter distribution measurement method, the dispersibility of the silver powder in the silver-containing slurry can be improved.SELECTED DRAWING: Figure 1
【課題】表面処理剤の種類を変更することなく、従来よりも粒度分布が小さく、かつ、その銀粉をペースト化して電極形成を行った場合に低抵抗となる銀粉の製造方法を提供する。【解決手段】銀粉の製造工程において、銀粉のスラリーに、レーザー回折式粒度分布測定法により得られる体積基準の累積50%粒子径D50が1.5μm以下の表面処理剤のミセルを含むO/W型のエマルションを添加することにより、銀粉を含むスラリーにおける銀粉の分散性が改善される。【選択図】図1 |
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Bibliography: | Application Number: JP20210047972 |