PHOTODETECTOR, PHOTO DETECTION SYSTEM, LIDAR DEVICE, AND VEHICLE

To provide a photodetector, a photo detection system, a LIDAR device, and a vehicle, capable of improving sensitivity.SOLUTION: A photodetector includes an element 10 and a structure 20. The element 10 includes: a first semiconductor region 1 of a first conductivity type, a second semiconductor regi...

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Main Authors FUJIWARA IKUO, SASAKI KEITA, ATSUTA MASAKI, SUZUKI KAZUHIRO, SHIMIZU MARIKO, OKAMOTO KAZUAKI, KWON HONAM
Format Patent
LanguageEnglish
Japanese
Published 27.09.2021
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Summary:To provide a photodetector, a photo detection system, a LIDAR device, and a vehicle, capable of improving sensitivity.SOLUTION: A photodetector includes an element 10 and a structure 20. The element 10 includes: a first semiconductor region 1 of a first conductivity type, a second semiconductor region 2 of the first conductivity type, and a third semiconductor region 3 of a second conductivity type. The second semiconductor region 2 is provided on the first semiconductor region 1. The third semiconductor region 3 is provided on the second semiconductor region 2. The structure 20 is provided around the element 10 on a first plane perpendicular to a first direction. The structure 20 includes a first insulation part 21, a metal-containing part 25, and a second insulation part 22. The metal-containing part 25 is provided above the first insulation part 21. At least part of the metal-containing part 25 is positioned at the same height as that of the third semiconductor region 3. The second insulation part 22 is positioned between the metal-containing part 25 and the element 10 on the first plane. The first insulation part 21's thickness is larger than the second insulation part 22's thickness on the first plane.SELECTED DRAWING: Figure 3 【課題】感度を向上可能な、光検出器、光検出システム、ライダー装置、及び車を提供する。【解決手段】光検出器は、素子10及び構造体20を含む。素子10は、第1導電形の第1半導体領域1と、第1導電形の第2半導体領域2と、第2導電形の第3半導体領域3と、を含む。第2半導体領域2は、第1半導体領域1の上に設けられる。第3半導体領域3は、第2半導体領域2の上に設けられる。構造体20は、第1方向に垂直な第1面において素子10の周りに設けられる。構造体20は、第1絶縁部21、金属含有部25、及び第2絶縁部22を含む。金属含有部25は、第1絶縁部21よりも上方に設けられる。金属含有部25の少なくとも一部は、第3半導体領域3と同じ高さに位置する。第2絶縁部22は、前記第1面において金属含有部25と素子10との間に位置する。第1絶縁部21の厚みは、前記第1面における第2絶縁部22の厚みよりも大きい。【選択図】図3
Bibliography:Application Number: JP20200050754