SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR STORAGE DEVICE

To provide a semiconductor storage device whose charge holding characteristic can be improved.SOLUTION: A memory cell array 100 includes a plurality of word lines WL, a semiconductor layer 10, a plurality of interlayer insulating layers 12, a tunnel insulating film 14, an intermediate insulating fil...

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Bibliographic Details
Main Author UCHIYAMA YASUHIRO
Format Patent
LanguageEnglish
Japanese
Published 27.09.2021
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Summary:To provide a semiconductor storage device whose charge holding characteristic can be improved.SOLUTION: A memory cell array 100 includes a plurality of word lines WL, a semiconductor layer 10, a plurality of interlayer insulating layers 12, a tunnel insulating film 14, an intermediate insulating film 16, a plurality of charge accumulation layers 18, a plurality of lower block insulating layers 20, a plurality of upper block insulating layers 22, a core insulating layer 24, and a cover insulating film 26. The word lines WL and the interlayer insulating layers 12 form a multilayer body 30. The interlayer insulating layer 12 is an insulating layer. The word line WL is a gate electrode layer. The tunnel insulating film 14 is a first insulating film. The intermediate insulating film 16 is a second insulating film. The word lines WL and the interlayer insulating layers 12 are stacked on a semiconductor substrate alternately in a z direction (first direction). The word lines WL are disposed apart from each other in the z direction. The word lines WL are disposed apart from each other repeatedly in the z direction.SELECTED DRAWING: Figure 2 【課題】電荷保持特性の向上が可能な半導体記憶装置を提供する。【解決手段】メモリセルアレイ100は、複数のワード線WL、半導体層10、複数の層間絶縁層12、トンネル絶縁膜14、中間絶縁膜16、複数の電荷蓄積層18、複数の下部ブロック絶縁層20、複数の上部ブロック絶縁層22、コア絶縁層24及びカバー絶縁膜26を備える。複数のワード線WLと複数の層間絶縁層12が積層体30を構成する。層間絶縁層12は、絶縁層である。ワード線WLは、ゲート電極層である。トンネル絶縁膜14は、第1の絶縁膜である。中間絶縁膜16は、第2の絶縁膜である。ワード線WLと層間絶縁層12は、半導体基板の上に、z方向(第1の方向)に交互に積層される。ワード線WLは、z方向に離間して配置される。ワード線WLは、互いに離間してz方向に繰り返し配置される。【選択図】図2
Bibliography:Application Number: JP20200049902