SEMICONDUCTOR DEVICE

• Main Author: KAMIYAMA SEIICHI
• Format: Patent
• Language: English; Japanese
• Published: 27.09.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a highly reliable semiconductor device.SOLUTION: A semiconductor device includes: a semiconductor chip 10 having a rectangular region including a first corner portion 14 having a first notch portion, a second corner portion 18 being provided to diagonally face the first corner portion, a third corner portion 19, and a fourth corner portion 16 being provided to diagonally face the third corner portion on a surface and having a semiconductor element formed in the rectangular region; a first electrode 20 including a fifth corner portion being provided on the first corner portion and having a second notch portion 25, a sixth corner portion 28 being provided on the second corner portion, a seventh corner portion 29 being provided on the third corner portion, and an eighth corner portion being provided on the fourth corner portion, the first electrode being provided on the semiconductor element, and the first electrode being electrically connected to the semiconductor element; and a first connector 30 including a ninth corner portion being provided on the fifth corner portion and having a third notch portion and a twelfth corner portion being provided on the eighth corner portion, the first connector being provided on the first electrode, and the first connector being electrically connected to the first electrode.SELECTED DRAWING: Figure 1 【課題】信頼性の高い半導体装置を提供する。【解決手段】半導体装置において、第１切欠き部を有する第１角部１４と、第１角部と対角線上に向かい合って設けられた第２角部１８と、第３角部１９と、第３角部と対角線上に向かい合って設けられた第４角部１６と、を有する矩形領域を表面上に有し、矩形領域に半導体素子が形成された半導体チップ１０と、第１角部の上に設けられ、第２切欠き部２５を有する第５角部と、第２角部の上に設けられた第６角部２８と、第３角部の上に設けられた第７角部２９と、第４角部の上に設けられた第８角部と、を有し、半導体素子の上に設けられ、半導体素子と電気的に接続された第１電極２０と、第５角部の上に設けられ、第３切欠き部を有する第９角部と、第８角部の上に設けられた第１２角部と、を有し、第１電極の上に設けられ、第１電極と電気的に接続された第１コネクタ３０と、を備える。【選択図】図１