CONNECTION STRUCTURE AND CONNECTION METHOD OF FLEXIBLE CIRCUIT BOARDS

• Main Authors: YAMADA TAKASHI, MAKINO DAISUKE, ICHIKAWA HIDEO, KAWATO YOSHIYUKI, SHINOKI TAKASHI, ONO SATOSHI
• Format: Patent
• Language: English; Japanese
• Published: 27.09.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CURRENT COLLECTORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide a connection structure and a connection method of flexible circuit boards, capable of achieving high connection strength and low manufacturing cost.SOLUTION: A connection structure includes: a first flexible circuit board 10 forming a first connection pattern 13; and a second flexible circuit board 30 forming a second connection pattern 33. The first and second flexible circuit boards 10 and 30 are overlapped so as to connect first and second opposite connection patterns 13 and 33 via a conductive bonding agent layer 50. The first and second flexible circuit boards 10 and 30, positioned at both sides of the connection parts of the first and second connection patterns 13 and 33 are fixed by a super sonic wave deposition.SELECTED DRAWING: Figure 2 【課題】接続強度が強く、且つ製造コストの低廉化を図ることができるフレキシブル回路基板同士の接続構造及び接続方法を提供すること。【解決手段】第１の接続パターン１３を形成した第１のフレキシブル回路基板１０と、第２の接続パターン３３を形成した第２のフレキシブル回路基板３０とを具備し、対向する第１，第２の接続パターン１３，３３を導電性接着剤層５０を介在して接続するように第１，第２のフレキシブル回路基板１０，３０を重ね合わせる。第１，第２の接続パターン１３，３３の接続部の両側に位置する第１，第２のフレキシブル回路基板１０，３０同士を超音波溶着して固定する。【選択図】図２