PRESSURE DEVICE, MANUFACTURING APPARATUS AND MANUFACTURING METHOD FOR DEVICE ARRAY

• Main Authors: SHINDO OSAMU, MIYAKOSHI TOSHINOBU, KATO YASUO, KOIZUMI HIROSHI, YAMASHITA MAKOTO, SUNAGA SEIJURO, SHINDO RYO, IIZUKA HIROSHI, MAKITA KOETSU
• Format: Patent
• Language: English; Japanese
• Published: 16.09.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a pressure device, manufacturing apparatus and manufacturing method for device array, capable of stably manufacturing a device array on a packaging substrate.SOLUTION: A pressure device 10 for a device array 40 has a pressure plate 11 with a pressure part 12 for pressing the device array 40 constituted of a plurality of elements 40a-40c arranged on a packaging substrate 30. The pressure part 12 has a plate-like elastic material 14 and the thickness of the elastic material 14 is 0.5-2.0 times as much as that of the elements 40a-40c.SELECTED DRAWING: Figure 1 【課題】素子アレイを安定して実装基板上に製造することが可能な素子アレイの加圧装置、製造装置および製造方法を提供する。【解決手段】素子アレイ４０の加圧装置１０は、実装基板３０に配置された複数の素子４０ａ〜４０ｃからなる素子アレイ４０を加圧する加圧部１２を持つ加圧プレート１１を有する。加圧部１２は、板状の弾性材１４を有し、弾性材１４の厚みは、素子４０ａ〜４０ｃの厚みの０．５〜２．０倍である。【選択図】図１