PALLADIUM-NICKEL ALLOY PLATING FILM AND PRODUCING METHOD THEREOF

To provide a palladium-nickel alloy plating film and a producing method thereof, capable of reducing a palladium content in the palladium-nickel alloy plating film while maintaining corrosion resistance and a diffusion prevention function of a base metal material.SOLUTION: The continuous palladium-n...

Full description

Saved in:
Bibliographic Details
Main Author MATSUI HIRONORI
Format Patent
LanguageEnglish
Japanese
Published 13.09.2021
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online AccessGet full text

Cover

More Information
Summary:To provide a palladium-nickel alloy plating film and a producing method thereof, capable of reducing a palladium content in the palladium-nickel alloy plating film while maintaining corrosion resistance and a diffusion prevention function of a base metal material.SOLUTION: The continuous palladium-nickel alloy plating film has a difference of 10 wt.% or more of the palladium content in a thickness direction.SELECTED DRAWING: Figure 1 【課題】パラジウム−ニッケル合金めっき膜中のパラジウム含有量を低減する一方、耐食性や下地金属素材の拡散防止機能を維持することが可能な、パラジウム−ニッケル合金めっき膜及びその製造方法を提供する。【解決手段】連続したパラジウム−ニッケル合金めっき膜中のパラジウム含有量が厚み方向に１０ｗｔ％以上の差があることを特徴とするパラジウム−ニッケル合金めっき膜。【選択図】図１
Bibliography:Application Number: JP20200030372