CIRCUIT BOARD AND SEMICONDUCTOR MODULE

• Main Authors: SANO TAKASHI, KATO HIROMASA
• Format: Patent
• Language: English; Japanese
• Published: 09.09.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a ceramic circuit board with good TCT characteristics without being curved even by forming a projection part on a metal plate.SOLUTION: A ceramic circuit board includes: a first metal part which has a silicon nitride substrate with a first surface and a second surface and thickness of 0.33 mm or less and three-point bending strength of 500 MPa, a first copper plate joined to the first surface and a protrusion 5 protruding from the surface of a first metal plate; and a second metal part which has a second copper plate joined to the second surface. When the silicon nitride substrate is equally divided into first to third division sections along the long side direction, V1, V2, V3, V4, V5 and V6 are numbers satisfying (V4/V1+(V6/V3)≤2(V5/V2), 0.5≤V4/V1≤2, 0.5≤V5/V2≤2 and 0.5≤V6/V3≤2.SELECTED DRAWING: Figure 1 【課題】金属板に凸部を設けても湾曲せず、良いＴＣＴ特性を有するセラミックス回路基板を提供する。【解決手段】セラミックス回路基板１は、第１の面と第２の面とを有する厚さ０．３３ｍｍ以下で且つ３点曲げ強度５００ＭＰａ以上の窒化珪素基板と、第１の面に接合された第１の銅板と、第１の金属板の表面から突出する凸部５と、を有する第１の金属部と、第２の面に接合された第２の銅板を有する第２の金属部と、を具備する。窒化珪素基板が長辺方向に沿って第１ないし第３の分割部に等分割されるとき、Ｖ１、Ｖ２、Ｖ３、Ｖ４、Ｖ５およびＶ６は、（Ｖ４／Ｖ１＋（Ｖ６／Ｖ３）≦２（Ｖ５／Ｖ２）と、０．５≦Ｖ４／Ｖ１≦２と、０．５≦Ｖ５／Ｖ２≦２と、０．５≦Ｖ６／Ｖ３≦２と、を満足する数である。【選択図】図１