SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE

• Main Author: HATAKEYAMA SHINICHI
• Format: Patent
• Language: English; Japanese
• Published: 09.09.2021
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPARATUS SPECIALLY ADAPTED THEREFOR; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; ATOMISING APPARATUS; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; NOZZLES; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING APPARATUS; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

To enable control of removal of coating liquid applied to the side end faces of a substrate.SOLUTION: A substrate processing method includes applying coating liquid to at least the side end faces of a substrate while rotating the substrate, drying the coating liquid on the side end surface to form a coating film while rotating the substrate, spraying the solvent mist of the coating liquid from the back surface side of the substrate onto the peripheral portion of the substrate to remove the coating film only on the lower slope portion of the side end of the substrate while rotating the substrate, and leaving the coating film on the side end face and the upper slope portion of the side end.SELECTED DRAWING: Figure 1 【課題】基板の側端面に塗布された塗布液の除去の制御を可能にする。【解決手段】基板を処理する方法であって、前記基板を回転させながら、少なくとも基板の側端面まで塗布液を塗布すること、前記基板を回転させながら、前記側端面の塗布液を乾燥させ塗布膜を形成すること、前記基板を回転させながら、前記基板の裏面側から前記基板の周辺部に前記塗布液の溶剤のミストを噴霧し、前記基板の側端下側斜面部のみの前記塗布膜を除去して、側端面部及び側端上側斜面部の前記塗布膜を残置すること、を含む、基板処理方法。【選択図】図１