SEMICONDUCTOR DEVICE

• Main Author: TANIGUCHI KATSUMI
• Format: Patent
• Language: English; Japanese
• Published: 09.09.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To make it possible to prevent occurrence of peeling off of a sealing member.SOLUTION: A lower inner wall section 46 surface-contacts to an outer periphery surface 20a of a metal base substrate 23, and a middle inner wall section 44 is provided to a sealing member 52 side from the lower inner wall section 46 and is separated from the outer periphery surface 20a of a base circuit substrate 20 for constituting a gap 53. Then the gap 53 is sealed by the sealing member 52. Consequently, since the sealing member 52 surrounds the outer periphery (gap 53) of the base circuit substrate 20, a deviation in a lateral direction of Fig 1 (further in a direction normal to the sheet surface of the Fig 1) of the base circuit substrate 20 is suppressed. Further, since the sealing member 52 at the gap 53 and a supporting section 41a of a case 40 are engaged in a vertical direction of Fig 1, coming-off of the base circuit substrate 20 from a lower opening 46a is suppressed.SELECTED DRAWING: Figure 1 【課題】封止部材の剥離の発生を抑制することができる。【解決手段】下部内壁部４６は金属ベース基板２３の外周面２０ａに面接触し、中部内壁部４４は下部内壁部４６から封止部材５２側に設けられ、ベース回路基板２０の外周面２０ａから離間して間隙５３を構成する。そして、当該間隙５３が封止部材５２で封止される。このため、封止部材５２がベース回路基板２０の外周（間隙５３）を取り囲むことで、ベース回路基板２０の図１中左右方向（並びに図１の紙面に対して垂直方向）のずれを抑制する。さらに、間隙５３の部分の封止部材５２とケース４０の支持部４１ａとが図１中上下方向に係合するため、下部開口部４６ａからベース回路基板２０が抜けてしまうことが抑制される。【選択図】図１