THERMOELECTRIC CONVERSION MODULE AND METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE

To provide a thermoelectric conversion module where joining is performed while electrical conductivity is ensured.SOLUTION: A thermoelectric conversion module 1 includes a thermoelectric element 10, an electrode 30, and a multilayer film 20 with conductivity, the multilayer film being disposed betwe...

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Bibliographic Details
Main Authors UCHIDA KENTARO, YASUDA KAZUMASA
Format Patent
LanguageEnglish
Japanese
Published 09.09.2021
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Summary:To provide a thermoelectric conversion module where joining is performed while electrical conductivity is ensured.SOLUTION: A thermoelectric conversion module 1 includes a thermoelectric element 10, an electrode 30, and a multilayer film 20 with conductivity, the multilayer film being disposed between the thermoelectric element 10 and the electrode 30. The multilayer film 20 is joined to the electrode 30 via a solder layer 50. The thermoelectric element 10 comprises a porous thermoelectric material containing magnesium. The multilayer film 20 further includes: a palladium layer mainly composed of palladium; a nickel layer between the thermoelectric element 10 and the palladium layer, the nickel layer being mainly composed of nickel; and a gold layer between the palladium layer and the solder layer 50, the gold layer being mainly composed of gold.SELECTED DRAWING: Figure 2 【課題】 電気伝導度を担保しながら接合した熱電変換モジュールを提供する。【解決手段】熱電変換モジュール1は、熱電素子10と、電極30と、熱電素子10と電極30の間に配置され、導電性を有する多層膜20とを有する。多層膜20は、はんだ層50を介して電極30と接合される。熱電素子10は、マグネシウムを含む多孔質な熱電材料で構成されている。また、多層膜20は、パラジウムを主とするパラジウム層と、熱電素子10とパラジウム層の間にニッケルを主とするニッケル層と、パラジウム層とはんだ層50との間に、金を主とする金層とをさらに含む。【選択図】図2
Bibliography:Application Number: JP20200024844