METAL PASTE FOR JOINING, JOINT BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING JOINT BODY

• Main Authors: NATORI MICHIKO, SAKURAI KIWA, NEGISHI MOTOHIRO, ISHIKAWA MASARU, KAWANA YUKI, NAKAKO TAKEO
• Format: Patent
• Language: English; Japanese
• Published: 02.09.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASTING; CONDUCTORS; ELECTRICITY; INSULATORS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; PERFORMING OPERATIONS; POWDER METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; TRANSPORTING; WORKING METALLIC POWDER

To provide a metal paste for joining that can ensure sufficient joint strength even when performing joining under low compression in an atmosphere free of hydrogen, and provide a joint body and a semiconductor device, and a method for producing a joint body each of which uses the metal paste for joining.SOLUTION: A metal paste for joining has metal particles and a dispersion medium. The metal particles include sub micro copper particles coated with a C1-20 aliphatic or aromatic monocarboxylic acid and having a volume average particle size of 0.1 μm or more and 0.9 μm or less, and micro copper particles coated with a C1-20 aliphatic or aromatic monocarboxylic acid or a copper oxide and having a volume average particle size of 2 μm or more and 50 μm or less. The dispersion medium has an alcoholic compound that has a hydroxyl group at a terminal and has no ether linkage in a molecular chain, and a polyether alcoholic compound that has a hydroxyl group at a terminal and has ether linkage in a molecular chain. The content of the micro copper particles is 0.5 mass% or more and 50 mass% or less based on the total mass of the sub micro copper particles and micro copper particles.SELECTED DRAWING: None 【課題】水素を含まない雰囲気中、低加圧で接合する場合であっても、充分な接合強度を得ることができる接合用金属ペースト、それを用いる接合体及び半導体装置、並びに接合体の製造方法を提供すること。【解決手段】接合用金属ペーストは、金属粒子と、分散媒と、を含む接合用金属ペーストであって、金属粒子が、炭素数１〜２０の脂肪族若しくは芳香族モノカルボン酸で被覆された、体積平均粒径が０．１μｍ以上０．９μｍ以下のサブマイクロ銅粒子と、炭素数１〜２０の脂肪族若しくは芳香族モノカルボン酸又は酸化銅で被覆された、体積平均粒径が２μｍ以上５０μｍ以下のマイクロ銅粒子と、を含み、分散媒が、末端にヒドロキシル基を有し、分子鎖中にエーテル結合を有しないアルコール系化合物と、末端にヒドロキシル基を有し、分子鎖中にエーテル結合を有するポリエーテルアルコール系化合物と、を含み、マイクロ銅粒子の含有量が、サブマイクロ銅粒子及びマイクロ銅粒子の質量の合計を基準として、０．５質量％以上５０質量％以下である。【選択図】なし