MOUNTING BOARD MANUFACTURING DEVICE AND MOUNTING BOARD MANUFACTURING METHOD

• Main Authors: MOTOYAMA DAIKI, MURATA TAKANORI
• Format: Patent
• Language: English; Japanese
• Published: 02.09.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a mounting board manufacturing device which inhibits accumulation of deposits, and to provide a mounting board manufacturing method.SOLUTION: An opening 26 which is open to the side facing a conveyed mounting board 33 and extends in a driving direction of a board arrangement pin 31 supporting the mounting board 33 is formed at a casing 25 which houses a conveyance chain 15 of a reflow soldering device 1. An air blowout hole 37 which blows air for preventing fumes occurring when heat treatment is preformed to the mounting board 33 from flowing to the opening 26 of the housing 25 is formed at a housing upper part 25a in the housing 25.SELECTED DRAWING: Figure 3 【課題】付着物の堆積が抑制される実装基板の製造装置と、実装基板の製造方法とを提供する。【解決手段】リフローはんだ付け装置１の搬送チェーン１５を収容するケーシング２５には、搬送される実装基板３３に臨む側に向かって開口し、実装基板３３を支持する基板配置ピン３１の駆動方向に延在する開口部２６が形成されている。ハウジング２５におけるハウジング上部２５ａには、実装基板３３に熱処理を行う際に発生するヒュームが、ハウジング２５の開口部２６へ向かって流れ込むのを阻止するエアーを吹き出だすエアー吹き出し孔３７が形成されている。【選択図】図３