ELECTRONIC CIRCUIT DEVICE

• Main Authors: ARAKI TAKAHIRO, TOKUYAMA TAKESHI, SENOO MASAHIRO
• Format: Patent
• Language: English; Japanese
• Published: 30.08.2021
• Subjects: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONTROL OR REGULATION THEREOF; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide an electronic circuit device that can efficiently cool a circuit board while securing the sealability of a coolant passage.SOLUTION: An electronic circuit device 1 includes a circuit board 10 where a wiring layer 12 is formed, a conductor 20 electrically connected to the wiring layer 12, a passage formation body 50 forming a passage of a coolant 51 flowing in contact with the circuit substrate 10 together with the circuit board 10, a fastening member 30 that fastens the circuit board 10 and the conductor 20, and a sealing member 40 for sealing the passage of the coolant 51. In the circuit board 10, a penetration hole 14 penetrating between a cooling surface where the passage of the coolant 51 is formed and a back surface on the opposite side of the cooling surface is formed. In the conductor 20, a penetration hole 21 communicating with the penetration hole 14 is formed. Since the fastening member 30 fastens the circuit board 10 and the conductor 20 through the penetration hole 14 and the penetration hole 21, the sealing member 40 closes the penetration hole 14 and the passage of the coolant 51 is sealed.SELECTED DRAWING: Figure 6 【課題】冷媒流路のシール性を確保しつつ、回路基板を効率的に冷却可能な電子回路装置を提供する。【解決手段】電子回路装置１は、配線層１２が形成された回路基板１０と、配線層１２と電気的に接続される導体２０と、回路基板１０に接触して流れる冷媒５１の流路を回路基板１０とともに形成する流路形成体５０と、回路基板１０と導体２０とを締結するための締結部材３０と、冷媒５１の流路を密閉するためのシール部材４０とを備える。回路基板１０には、冷媒５１の流路が形成される冷却面と冷却面とは反対側の裏面との間を貫通する貫通孔１４が形成される。導体２０には、貫通孔１４と連通する貫通孔２１が形成される。締結部材３０が貫通孔１４および貫通孔２１を介して回路基板１０と導体２０とを締結することで、シール部材４０が貫通孔１４を塞いで冷媒５１の流路が密閉される。【選択図】図６