SEMICONDUCTOR DEVICE

• Main Authors: NAKANISHI YASUO, MUGINO YOICHI
• Format: Patent
• Language: English; Japanese
• Published: 30.08.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PICTORIAL COMMUNICATION, e.g. TELEVISION; SEMICONDUCTOR DEVICES

To provide a semiconductor device capable of improving connection reliability of wiring formed on a semiconductor lamination structure including a layer having at least two different kinds of compositions.SOLUTION: A semiconductor light-emitting device 1 includes a base layer 16, a mesa part 13 including a layer having at least two different kinds of compositions laminated on the base layer 16, and metal wiring 27 led out to a lead-out part 14 from an apex of the mesa part 13 through a side part of the mesa part 13. The meta part 13 includes a first side surface 17B, a second side surface 18B crossing the first side surface 17B, and a wiring arrangement part 19 in which the metal wiring 27 is arranged. The metal wiring 27 strides over an intersection 29 between the first side surface 17B and the second side surface 18B of the wiring arrangement part 19, and covers the first side surface 17B and the second side surface 18B.SELECTED DRAWING: Figure 1 【課題】少なくとも２種以上の異なる組成を有する層を含む半導体積層構造上に形成された配線の接続信頼性を向上することができる半導体装置を提供する。【解決手段】半導体発光装置１は、べース層１６と、ベース層１６上に積層された少なくとも２種以上の異なる組成を有する層を含むメサ部１３と、メサ部１３の頂部からメサ部１３の側部を通って引き出し部１４に引き出された金属配線２７とを含み、メサ部１３は、第１側面１７Ｂおよび第１側面１７Ｂに交差する第２側面１８Ｂを有し、金属配線２７が配置された配線配置部１９を含み、金属配線２７は、配線配置部１９の第１側面１７Ｂと第２側面１８Ｂとの間の交差部２９に跨り、かつ第１側面１７Ｂおよび第２側面１８Ｂを覆っている。【選択図】図１