FLEXIBLE DEVICE AND ELECTRONIC APPARATUS

To provide a flexible device capable of reducing bending marks, and an electronic apparatus comprising such a flexible device.SOLUTION: A flexible device comprises a flexible panel 10 with a light emission surface and a back surface, an adhesive layer 40 in contact with the back surface, and a backi...

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Bibliographic Details
Main Authors SEKI TAKEHIRO, YAMAZAKI KATSUMASA
Format Patent
LanguageEnglish
Japanese
Published 30.08.2021
Subjects
ADVERTISING
BASIC ELECTRIC ELEMENTS
CRYPTOGRAPHY
DISPLAY
DISPLAYING
EDUCATION
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LABELS OR NAME-PLATES
PHYSICS
SEALS
SEMICONDUCTOR DEVICES
SIGNS
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Summary:To provide a flexible device capable of reducing bending marks, and an electronic apparatus comprising such a flexible device.SOLUTION: A flexible device comprises a flexible panel 10 with a light emission surface and a back surface, an adhesive layer 40 in contact with the back surface, and a backing layer 50 bonded to the back side via the adhesive layer. The backing layer did not break when it is bent at a bending radius of 3 mm, the Young's modulus of the backing layer is 70 GPa or more, and when the strain of the backing layer is 0.7%, the backing layer has a material and thickness in which the strain is dissociated from a tangent line near an origin by 0.05% or less in a stress strain curve.SELECTED DRAWING: Figure 1 【課題】曲げ跡を低減することの可能なフレキシブルデバイス、およびそのようなフレキシブルデバイスを備えた電子機器を提供する。【解決手段】本開示の一実施の形態に係るフレキシブルデバイスは、光出射面および裏面を有するフレキシブルパネル１０と、裏面に接する粘着層４０と、粘着層を介して裏面に貼り合わされた裏貼り層５０とを備える。裏貼り層は、当該裏貼り層を曲げ半径３ｍｍで曲げたときに破断せず、当該裏貼り層のヤング率が７０ＧＰａ以上であり、当該裏貼り層の歪みが０．７％のとき、応力歪み曲線で、歪みが原点近傍の接線から０．０５％以下の解離となる材料および厚さとなっている。【選択図】図１
Bibliography:Application Number: JP20200016849