RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METALLIC FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD

• Main Authors: SHINPO TAKASHI, YAMADA YUJI, YAMADA TAKAHIRO, FUJISAWA HIROYUKI, OTSUKA MANABU
• Format: Patent
• Language: English; Japanese
• Published: 30.08.2021
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

To provide a resin composition which enables production of a cured product that is low in dielectric characteristics, has high heat resistance, is excellent in desmear properties and can suppress tackiness (adhesiveness) of the surface, and has such moldability as to be applied to a laminated wiring board.SOLUTION: A resin composition contains (A) a polyphenylene ether compound, (B) a maleimide compound, (C) a curing agent, (D) a phosphinic acid metal salt-based flame retardant, (E) an inorganic filler surface-treated a hydrophobic silane coupling agent, and (F) an inorganic filler surface-treated with a hydrophilic silane coupling agent, and contains 20-80 mass% of the (E) inorganic filler with respect to the total amount of the (E) inorganic filler and the (F) inorganic filler.SELECTED DRAWING: Figure 1 【課題】誘電特性が低く、耐熱性が高く、かつ、デスミア性に優れ、表面のタック性（粘着性）を抑えることができる硬化物を得ることができ、積層配線板への適用が可能な成形性を備えた樹脂組成物を提供すること。【解決手段】（Ａ）ポリフェニレンエーテル化合物と、（Ｂ）マレイミド化合物と、（Ｃ）硬化剤と、（Ｄ）ホスフィン酸金属塩系難燃剤と、（Ｅ）疎水性シランカップリング剤で表面処理された無機フィラーと、（Ｆ）親水性シランカップリング剤で表面処理された無機フィラーと、を含有し、前記（Ｅ）無機フィラーを、前記（Ｅ）無機フィラー及び前記（Ｆ）無機フィラーの合計量に対して、２０〜８０質量%で含有する、樹脂組成物。【選択図】図１