MANUFACTURING METHOD OF RADAR COVER AND RADAR COVER

To enable a glittering film to be formed only at a needed portion without using a mask member separately in a radar cover in which the glittering film is disposed between a transparent member and a back surface member.SOLUTION: A manufacturing method of a radar cover includes: a transparent member f...

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Bibliographic Details
Main Authors OTA KOSHIRO, YOSHIYA HIROKO
Format Patent
LanguageEnglish
Japanese
Published 26.08.2021
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Summary:To enable a glittering film to be formed only at a needed portion without using a mask member separately in a radar cover in which the glittering film is disposed between a transparent member and a back surface member.SOLUTION: A manufacturing method of a radar cover includes: a transparent member formation step in which a transparent member 11 is formed; a glittering film formation step in which a glittering film 12 having electric wave transmissivity is formed fastened to a back surface of the transparent member 11; a cover part arrangement step in which mask parts 13a for covering parts of the glittering film 12 from the opposite side of the transparent member 11 are arranged; a laser patterning step in which the glittering film 12 is patterned by laser radiation with the mask parts 13a used as masks; and a back surface member formation step in which the mask parts 13a are taken into a back surface member 13 to form the back surface member 13 having the mask parts 13a and a resin made support member 13b which covers the mask parts 13a and is deposited to the mask parts 13a and at least a part of the transparent member 11.SELECTED DRAWING: Figure 4 【課題】透明部材と背面部材との間に光輝性膜が配置されたレーダカバーにおいて、別途マスク部材を用いることなく、光輝性膜を必要な部位にのみ成膜可能とする。【解決手段】透明部材11を形成する透明部材形成工程と、電波透過性を有する光輝性膜12を透明部材11の背面に対して固着された状態で形成する光輝性膜形成工程と、透明部材11と反対側から光輝性膜12の一部を覆うマスク部13aを配置する被覆部配置工程と、マスク部13aをマスクとして光輝性膜12をレーザ照射によりパターニングするレーザパターニング工程と、マスク部13aを背面部材13に取り込むことにより、マスク部13aとマスク部13aを覆ってマスク部13a及び透明部材11の少なくとも一部に溶着された樹脂製の支持部材13bとを有する背面部材13を形成する背面部材形成工程とを有する。【選択図】図4
Bibliography:Application Number: JP20200014664