LIGHT-EMITTING DEVICE

• Main Authors: OKURA SHINYA, SOGAI TAKANOBU, OSHODANI KOJI
• Format: Patent
• Language: English; Japanese
• Published: 19.08.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a light-emitting device whose light extraction efficiency can be improved.SOLUTION: A light-emitting device according to one aspect of the present invention comprises: a base plate having a first surface including a first region and a second region; a first frame part that is provided on the base plate and surrounds the first region; a light-emitting element provided on the base plate's part in the first region; a light transmissive first member that is provided inside the first frame part and covers the light-emitting element; a second frame part that is provided on the base plate and surrounds the second region; a plurality of electronic components provided on the base plate's part in the second region; and a non-light transmissive second member that is provided inside the second frame part and covers the plurality of electronic components. Part of the first frame part and part of the second frame part are provided integrally. A top face of the first member is positioned above a top face of the first frame part, a top face of the second frame part, and a top face of the second member. The top face of the second member is positioned below the top face of the first frame part and the top face of the second frame part. Each of the plurality of electronic components is electrically connected to the base plate by a bonding wire.SELECTED DRAWING: Figure 1 【課題】光取り出し効率を向上させることが可能な発光装置を提供する。【解決手段】本発明の一態様に係る発光装置は、第１領域及び第２領域を含む第１面を有する基板と、前記基板上に設けられ、前記第１領域を囲む第１枠部と、前記第１領域の前記基板上に設けられた発光素子と、前記第１枠部の内側に設けられ、前記発光素子を被覆する透光性の第１部材と、前記基板上に設けられ、前記第２領域を囲む第２枠部と、前記第２領域の前記基板上に設けられた複数の電子部品と、前記第２枠部の内側に設けられ、前記複数の電子部品を被覆する非透光性の第２部材と、を備え、前記第１枠部の一部と前記第２枠部の一部は、一体に設けられ、前記第１部材の上面は、前記第１枠部の上面、前記第２枠部の上面、及び前記第２部材の上面よりも上方に位置し、前記第２部材の上面は、前記第１枠部の上面及び前記第２枠部の上面よりも下方に位置し、前記複数の電子部品は、それぞれ、ボンディングワイヤにより前記基板と電気的に接続されている。【選択図】図１