POLYAMIDE PARTICLES, PRODUCTION PROCESS THEREFOR, RESIN COMPOSITION, AND MOLDED ARTICLE

• Main Authors: ROKUTA MITSUTERU, UNO TAKAYUKI, NAKAYA YOSHIKI
• Format: Patent
• Language: English; Japanese
• Published: 19.08.2021
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

To provide polyamide particles to improve toughness of a cured product of a curable resin composition and a production process therefor.SOLUTION: Polyamide particles including polyamide and having a water absorption rate of 0.5 to 2.5 wt.% are prepared. The polyamide may be a semicrystalline polyamide. The polyamide has a glass transition temperature of approximately 100 to 150°C. The polyamide may have an alicyclic structure. The polyamide particles of this invention have an average particle size of approximately 5 to 40 μm and a specific surface area determined by the BET method of approximately 0.08 to 12 m2/g. The polyamide particles of the present invention may also be spherical and have an average particle size of approximately 15 to 25 μm. Furthermore, the polyamide particles of the present invention may have an exothermic peak in a temperature range between the glass transition temperature and a melting point of the polyamide upon heating the polyamide particles at a rate of 10°C/min by differential scanning calorimetry (DSC).SELECTED DRAWING: None 【課題】硬化性樹脂組成物の硬化物の靱性を向上させるためのポリアミド粒子及びその製造方法を提供する。【解決手段】ポリアミドを含み、かつ吸水率が０．５〜２．５重量％であるポリアミド粒子を調製する。前記ポリアミドは半結晶性ポリアミドであってもよい。前記ポリアミドのガラス転移温度は１００〜１５０℃程度である。前記ポリアミドは脂環式構造を有していてもよい。本発明のポリアミド粒子の平均粒径は５〜４０μｍ程度であり、ＢＥＴ法による比表面積が０．０８〜１２ｍ２／ｇ程度である。また、本発明のポリアミド粒子は、球状であり、かつ平均粒径が１５〜２５μｍ程度であってもよい。さらに、前記ポリアミド粒子は、示差走査熱量測定（ＤＳＣ）によって１０℃／分の速度で昇温したとき、前記ポリアミドのガラス転移温度と融点との間の温度範囲に発熱ピークを有していてもよい。【選択図】なし