RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, DAM AGENT, AND SEMICONDUCTOR DEVICE

• Main Authors: IWATANI KAZUKI, ARAI FUMINORI
• Format: Patent
• Language: English; Japanese
• Published: 12.08.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

To provide a photocurable and thermosetting resin composition which has high adhesive strength (in particular, high peel strength) after curing, and can suppress reduction in adhesive strength after humidity test after curing.SOLUTION: A resin composition contains (A) an acrylic resin, (B) a thiol compound represented by C(CH2OR1)(CH2OR2)(CH2OR3)(CH2OR4), in which at least one of R1, R2, R3 and R4 each independently hydrogen or C3H6SH, and at least one of R1, R2, R3 and R4 is C3H6SH, and (C) a latent curing accelerator.SELECTED DRAWING: None 【課題】 硬化後に高い接着強度（特に、高いピール強度）を有し、かつ、硬化後の耐湿試験後の接着強度の低下を抑制することのできる、光および熱硬化性の樹脂組成物が提供される。【解決手段】（Ａ）アクリル樹脂、（Ｂ）Ｃ（ＣＨ２ＯＲ１）（ＣＨ２ＯＲ２）（ＣＨ２ＯＲ３）（ＣＨ２ＯＲ４）（式中、Ｒ１、Ｒ２、Ｒ３およびＲ４は、それぞれ独立して、水素またはＣ３Ｈ６ＳＨであり、かつ、Ｒ１、Ｒ２、Ｒ３およびＲ４のうちの少なくとも１つは、Ｃ３Ｈ６ＳＨである）で表されるチオール化合物、および（Ｃ）潜在性硬化促進剤を含有する、樹脂組成物が提供される。【選択図】なし