CIRCUIT BOARD

To provide an elastic circuit board having a structure capable of suppressing breakage of an insulation layer and wiring without using a reinforcement layer.SOLUTION: A disclosed circuit board includes an elastic insulation layer, elastic wiring formed on the insulating layer, and a metal layer lami...

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Bibliographic Details
Main Authors FUKAO TOMOHIRO, SAWADA TOMOAKI, MICHIGAMI KYOSUKE
Format Patent
LanguageEnglish
Japanese
Published 05.08.2021
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:To provide an elastic circuit board having a structure capable of suppressing breakage of an insulation layer and wiring without using a reinforcement layer.SOLUTION: A disclosed circuit board includes an elastic insulation layer, elastic wiring formed on the insulating layer, and a metal layer laminated on the insulating layer. The metal layer has a land overlaid on the insulating layer, and a protrusion part protruding from the land. The protrusion part has the insulating layer and the elastic part formed in a shape that can expand and contract according to the expansion and contraction of the wiring in a connection where at least part of the protrusion part and the wiring overlap.SELECTED DRAWING: Figure 1 【課題】補強層を用いることなく絶縁層及び配線の破断を抑制することを可能にする構造を有する伸縮性の回路基板を提供することを目的とする。【解決手段】本出願は、伸縮性の絶縁層と、前記絶縁層上に形成された伸縮性の配線と、前記絶縁層上に重ねられた金属層とを備える回路基板を開示する。前記金属層は、前記絶縁層に重ねられたランドと、前記ランドから突出する突出部と、を有する。前記突出部は、前記突出部の少なくとも一部と前記配線とが重なる接続部において、前記絶縁層及び前記配線の伸縮に応じて伸縮可能な形状に形成された伸縮部を有する。【選択図】図１
Bibliography:Application Number: JP20200005361