POLISHING HEAD SYSTEM AND POLISHING APPARATUS

To provide a polishing head system capable of precisely controlling a film-thickness profile of a workpiece, such as a wafer, a substrate, or a panel.SOLUTION: A polishing head system includes a polishing head 7 having a plurality of piezoelectric elements 47 configured to apply pressing forces to a...

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Main Authors NAKAMURA TAKAMASA, TAKADA NOBUYUKI, YAGI YUJI, TAKADA YASUHIRO, OBATA ITSUKI, YASUDA HOZUMI, WATANABE KAZUHIDE, YANAI AKIO, TAKAHASHI NOBUYUKI, SAKATA KEISUKE
Format Patent
LanguageEnglish
Japanese
Published 05.08.2021
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:To provide a polishing head system capable of precisely controlling a film-thickness profile of a workpiece, such as a wafer, a substrate, or a panel.SOLUTION: A polishing head system includes a polishing head 7 having a plurality of piezoelectric elements 47 configured to apply pressing forces to a workpiece W, and an operation controller 10 configured to determine instruction values of voltages to be applied to the plurality of piezoelectric elements 47.SELECTED DRAWING: Figure 5 【課題】ウェーハ、基板、パネルなどのワークピースの膜厚プロファイルを精密に制御することができる研磨ヘッドシステムを提供する。【解決手段】研磨ヘッドシステムは、複数の押付力をワークピースＷに加える複数の圧電素子４７を有する研磨ヘッド７と、複数の圧電素子４７に印加すべき電圧の複数の指令値を決定する動作制御部１０を備えている。【選択図】図５
Bibliography:Application Number: JP20200006393