REMOVAL METHOD OF ELECTRONIC COMPONENT

• Main Author: FURUYA KOICHI
• Format: Patent
• Language: English; Japanese
• Published: 02.08.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide a removal method of an electronic component which can easily remove an electronic component soldered to a substrate while suppressing deterioration of the quality of the electronic component and the substrate.SOLUTION: A removal method of an electronic component includes the steps of arranging an urging member that generates urging force so as to separate an electronic component from a first surface of the substrate in a gap between the first surface and the electronic component soldered to the first surface, supporting the substrate such that the first surface faces downward, and heating the solder directly or indirectly.SELECTED DRAWING: Figure 3 【課題】電子部品及び基板の品質の劣化を抑制しながらも、基板に半田付けされた電子部品を容易に取り外すことの可能な電子部品の取り外し方法を提供する。【解決手段】電子部品の取り外し方法は、基板の第一面と、第一面に半田付けされた電子部品と、の間の空隙に、電子部品が第一面から離れるような付勢力を生じさせる付勢部材を配置する工程と、第一面が下方となるように基板を支持する工程と、直接的又は間接的に半田を加熱する工程と、を備えている。【選択図】図３