SEMICONDUCTOR WAFER CLEANING DEVICE AND SEMICONDUCTOR WAFER CLEANING METHOD

• Main Authors: TOMITA MICHIHIKO, NAKAO YUKI, OKUBO TOMOHIRO, NODA KAITO
• Format: Patent
• Language: English; Japanese
• Published: 02.08.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To propose a semiconductor wafer cleaning device and a cleaning method capable of suppressing the adhesion of a cleaning liquid mist to the surface of a semiconductor wafer during cleaning of the semiconductor wafer.SOLUTION: In a semiconductor wafer cleaning device 1 according to the present invention, a spin cup 20 includes an annular side wall portion 21, an inclined portion 22 in which a lower end portion 22d is connected to an upper end portion 21c of a side wall portion 21, and which is inclined toward a rotary table 13 in the vertical direction, and an annular return portion 23 in which an upper end portion 23c is connected to an upper end portion 22c of the inclined portion 22. A height position h21 of the upper end portion 21c of the side wall portion 21 is arranged at a position lower than a height position h14a of an upper end portion 14a of a wafer holding portion 14, and an angle θ22 of the inclined portion 22 with respect to the horizontal plane and a width w of the inclined portion 22 are configured to satisfy the following equation (A). θ22≥-0.65×w+72.9° (A).SELECTED DRAWING: Figure 1 【課題】半導体ウェーハの洗浄中に半導体ウェーハの表面に洗浄液のミストが付着するのを抑制することができる半導体ウェーハの洗浄装置および洗浄方法を提案する。【解決手段】本発明による半導体ウェーハの洗浄装置１においては、スピンカップ２０が、環状の側壁部２１と、下端部２２ｄが側壁部２１の上端部２１ｃに接続されており、鉛直方向に対して回転テーブル１３側に傾斜している傾斜部２２と、上端部２３ｃが傾斜部２２の上端部２２ｃに接続されている環状の返し部２３とを有し、側壁部２１の上端部２１ｃの高さ位置ｈ21が、ウェーハ保持部１４の上端部１４ａの高さ位置ｈ14aよりも低い位置に配置されており、水平面に対する傾斜部２２の角度θ22および傾斜部２２の幅ｗが下記の式（Ａ）を満たすように構成されている。θ22≧−０．６５×ｗ＋７２．９° （Ａ）【選択図】図１