RESIN COMPOSITION AND RESIN FILM

• Main Authors: NISHIYAMA TEPPEI, TANAKA MUTSUTO, DEAI HIROYUKI, KAKIZAKA KOTA
• Format: Patent
• Language: English; Japanese
• Published: 26.07.2021
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide a resin composition that further improves dielectric properties of an aliphatic polyimide, enabling coping with higher frequency electronic apparatuses, and a resin film.SOLUTION: A resin composition contains: (A) a nonvolatile organic compound component containing a polyamide acid or polyimide, obtained by the reaction of a tetracarboxylic acid anhydride component with a diamine component, the diamine component containing, based on the total amount of it, a dimer diamine composition of 40 mol% or more, the dimer diamine composition predominantly composed of a dimer diamine in which two terminal carboxylic acid groups of a dimer acid are substituted with a primary aminomethyl group or amino group; and (B) silica particles. The (B) component content is 5-60 wt.% relative to the total content of the (A) component (where the polyamide acid content is calculated in terms of imidized polyimide) and the (B) component.SELECTED DRAWING: None 【課題】脂肪族系ポリイミドの誘電特性をさらに改善することによって、電子機器の高周波化への対応が可能な樹脂組成物及び樹脂フィルムを提供する。【解決手段】（Ａ）テトラカルボン酸無水物成分と、全ジアミン成分に対し、ダイマー酸の二つの末端カルボン酸基が１級のアミノメチル基又はアミノ基に置換されてなるダイマージアミンを主成分とするダイマージアミン組成物を４０モル％以上含有するジアミン成分と、を反応させてなるポリアミド酸又はポリイミドを含有する不揮発性有機化合物成分、及び、（Ｂ）シリカ粒子、を含有するとともに、（Ｂ）成分が（Ａ）成分（ただし、ポリアミド酸はイミド化されたポリイミドに換算する）及び（Ｂ）成分の合計に対し５〜６０重量％の範囲内である樹脂組成物。【選択図】なし