MULTILAYER CERAMIC ELECTRONIC COMPONENT

• Main Authors: KANZAKI TAISUKE, ONISHI KOSUKE, DOI AKITAKA
• Format: Patent
• Language: English; Japanese
• Published: 15.07.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRICITY

To provide a multilayer ceramic electronic component capable of suppressing the generation of voids by densifying a metal in an external electrode even when a ceramic material which is a common material is dispersed in the external electrode.SOLUTION: A multilayer ceramic capacitor 10 according to the present invention as a multilayer ceramic electronic component includes a laminated body 12 and an external electrodes 26 on both end faces of the laminated body 12. The external electrodes 26 includes a base electrode layer 28 and a plating layer 30 arranged on the base electrode layer 28. The base electrode layer 28 includes Ni which is a first metal component, Sn which is a second metal component, and a ceramic material 38. Around the ceramic material 38, an alloy portion 40 which is an alloyed portion of the Ni which is the first metal component, and Sn which is the second metal component is provided.SELECTED DRAWING: Figure 2 【課題】外部電極中に共材であるセラミック材料が分散している場合でも、外部電極中の金属が緻密化することで、空隙の発生を抑制しうる積層セラミック電子部品を提供する。【解決手段】本発明に係る積層セラミック電子部品としての積層セラミックコンデンサ１０は、積層体１２と、積層体１２の両端面に外部電極２６とを備える。外部電極２６は、下地電極層２８と、下地電極層２８上に配置されるめっき層３０と、を有する。下地電極層２８は、第１の金属成分であるＮｉ、第２の金属成分であるＳｎ、およびセラミック材料３８を含む。セラミック材料３８の周囲において、第１の金属成分であるＮｉと第２の金属成分であるＳｎとが合金化した部分である合金部４０を含む。【選択図】図２