THERMOSETTING RESIN COMPOSITION FOR LDS

• Main Author: MITSUTA MASAYA
• Format: Patent
• Language: English; Japanese
• Published: 15.07.2021
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a resin composition which is excellent in balance among handling stability and dimensional stability in manufacture of a cured product, and processing stability by LDS.SOLUTION: A liquid thermosetting resin composition for LDS that is used in LASER DIRECT STRUCTURING (LDS) contains a thermosetting resin, an inorganic filler, a non-conductive metal compound forming a metal core by irradiation with active energy rays, and a coupling agent. A content of the inorganic filler in the thermosetting resin composition for LDS is 40 mass% or more and 85 mass% or less with respect to the whole thermosetting resin composition for LDS.SELECTED DRAWING: None 【課題】硬化物の製造の取り回し安定性および寸法安定性と、ＬＤＳによる加工安定性とのバランスに優れる樹脂組成物を提供する。【解決手段】LASER DIRECT STRUCTURING（ＬＤＳ）に用いる液状のＬＤＳ用熱硬化性樹脂組成物であって、熱硬化性樹脂と、無機充填材と、活性エネルギー線の照射により金属核を形成する非導電性金属化合物と、カップリング剤と、を含み、ＬＤＳ用熱硬化性樹脂組成物中の無機充填材の含有量が、ＬＤＳ用熱硬化性樹脂組成物全体に対して４０質量％以上８５質量％以下である、ＬＤＳ用熱硬化性樹脂組成物が提供される。【選択図】なし