ANTISTATIC RESIN COMPOSITION AND CONTAINER AND PACKAGING MATERIAL INCLUDING THE SAME

To provide an antistatic resin composition that has sufficiently lasting antistatic properties, hardly causes an elution of ions when processed into a molding, and is suitable for a storage/transport container and a packaging material for an electric/electronic component, and a container and a packa...

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Bibliographic Details
Main Authors ENJO NAOKI, NOMURA KAZUKIYO
Format Patent
LanguageEnglish
Japanese
Published 15.07.2021
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Summary:To provide an antistatic resin composition that has sufficiently lasting antistatic properties, hardly causes an elution of ions when processed into a molding, and is suitable for a storage/transport container and a packaging material for an electric/electronic component, and a container and a packaging material including the same.SOLUTION: An antistatic resin composition contains, based on a synthetic resin 100 pts.mass, at least one polymer compound (E) 3 to 40 pts.mass and at least one alkali metal salt (F) 0.01 to 8 pts.mass. The polymer compound (E) is at least one of polymer compounds obtained by a reaction of a polyester (a) that is obtained by a reaction of diol (a1) and dicarboxylic acid (a2), a compound (b) having at least one ethyleneoxy group and having hydroxy groups at both terminals, and an epoxy compound (D) having at least two epoxy groups. The diol (a1) is at least one of 1,4-butanediol and ethylene glycol. The dicarboxylic acid (a2) is a mixture of succinic acid or succinic acid-containing dicarboxylic acid.SELECTED DRAWING: None 【課題】持続性を有する充分な帯電防止性を有し、かつ、成形体とした場合にイオンの溶出がほとんどない、電気電子部品の収納・搬送容器および包装材に適した帯電防止性樹脂組成物ならびにこれを用いた容器および包装材を提供すること。【解決手段】合成樹脂100質量部に対し、1種以上の高分子化合物(E)を3〜40質量部と、1種以上のアルカリ金属の塩(F)を0.01〜8質量部とを含有する帯電防止性樹脂組成物であって、前記高分子化合物(E)が、ジオール(a1)とジカルボン酸(a2)が反応して得られるポリエステル(a)と、エチレンオキシ基を一つ以上有する両末端に水酸基を有する化合物(b)と、エポキシ基を2個以上有するエポキシ化合物(D)と、が反応して得られる高分子化合物の1種以上であって、前記ジオール(a1)が、1,4−ブタンジオール、またはエチレングリコールの少なくとも一方であり、前記ジカルボン酸(a2)が、コハク酸、またはコハク酸を含有するジカルボン酸の混合物である、帯電防止性樹脂組成物。【選択図】なし
Bibliography:Application Number: JP20190233956