PROCESSING METHOD FOR WORK-PIECE

To coat a whole surface of a wafer with a resin film, in applying plasma etching to the wafer having a bump formed on a surface side thereof to divide the wafer.SOLUTION: A processing method for a work-piece comprises: a holding step of holding a work-piece while turning a surface of the work-piece...

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Bibliographic Details
Main Author IIZUKA KENTARO
Format Patent
LanguageEnglish
Japanese
Published 01.07.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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