PROCESSING METHOD FOR WORK-PIECE

• Main Author: IIZUKA KENTARO
• Format: Patent
• Language: English; Japanese
• Published: 01.07.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To coat a whole surface of a wafer with a resin film, in applying plasma etching to the wafer having a bump formed on a surface side thereof to divide the wafer.SOLUTION: A processing method for a work-piece comprises: a holding step of holding a work-piece while turning a surface of the work-piece downward so that the surface faces an upper surface side of a stand supplied with curable resin having fluidity; a coating step of coating a whole surface of the work-piece with the curable resin so that the curable resin intrudes into a gap between a bump and the surface and the bump is buried in the curable resin, by moving the work-piece downward and pressing the surface side of the work-piece against the curable resin; a curing step of curing the curable resin to form resin films; a laser beam irradiating step of removing the resin films on respective division scheduled lines; a dividing step of supplying a plasmatized gas to the work-piece to divide the work-piece into individual device chips along the division scheduled lines, using the resin films as masks.SELECTED DRAWING: Figure 3 【課題】表面側にバンプが形成されたウェーハに対してプラズマエッチングを施してウェーハを分割する場合に、ウェーハの表面の全体を樹脂膜で覆う。【解決手段】流動性を有する硬化性樹脂が供給された台の上面側と対面する様に被加工物の表面を下向きにして被加工物を保持する保持工程と、被加工物を下方に移動させて、被加工物の表面側を硬化性樹脂に押し当てることにより、硬化性樹脂がバンプと表面との隙間に入り込み且つバンプが硬化性樹脂に埋まる様に、被加工物の表面の全体を硬化性樹脂で被覆する被覆工程と、硬化性樹脂を硬化させて樹脂膜を形成する硬化工程と、各分割予定ライン上の樹脂膜を除去するレーザービーム照射工程と、被加工物にプラズマ化したガスを供給して、樹脂膜をマスクとして各分割予定ラインに沿って被加工物を個々のデバイスチップに分割する分割工程と、を備える被加工物の加工方法を提供する。【選択図】図３