SEMICONDUCTOR DEVICE

To provide a small semiconductor device including a semiconductor element with excellent operation performance.SOLUTION: A semiconductor device 1 includes a semiconductor element 2 provided between a conductive layer 3 and a conductive layer 4 that face each other. Each of the conductive layer 3 and...

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Bibliographic Details
Main Authors IKEDA YOSHINARI, HORI MOTOHITO, NAKAJIMA TSUNEHIRO, HIRAO AKIRA
Format Patent
LanguageEnglish
Japanese
Published 24.06.2021
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Summary:To provide a small semiconductor device including a semiconductor element with excellent operation performance.SOLUTION: A semiconductor device 1 includes a semiconductor element 2 provided between a conductive layer 3 and a conductive layer 4 that face each other. Each of the conductive layer 3 and the conductive layer 4 is connected electrically to a positive electrode 2a and a negative electrode 2b of the semiconductor element 2. The conductive layer 3 and the conductive layer 4 are provided with a positive electrode terminal 3a and a negative electrode terminal 4a, respectively, on a direction D1 side. A control wire 6 electrically connected to a control electrode 2c of the semiconductor element 2 is drawn to the outside in a direction D2 opposite to the direction D1 of the conductive layer 3 and the conductive layer 4, and connected to a control terminal 8 positioning outside the conductive layer 3 and the conductive layer 4. An end part 8a of the control terminal 8 is arranged beside the positive electrode terminal 3a and the negative electrode terminal 4a. The influence of the electromagnetic field of main current 9b flowing from the positive electrode terminal 3a to the negative electrode terminal 4a on control current 9a flowing to the control terminal 8 is suppressed and the controllability of the semiconductor element 2 is increased.SELECTED DRAWING: Figure 1 【課題】半導体素子の動作性能に優れる小型の半導体装置を実現する。【解決手段】半導体装置1は、対向する導体層3と導体層4との間に設けられた半導体素子2を含む。導体層3及び導体層4にそれぞれ、半導体素子2の正極電極2a及び負極電極2bが電気的に接続される。導体層3及び導体層4には、方向D1側にそれぞれ、正極端子3a及び負極端子4aが設けられる。半導体素子2の制御電極2cと電気的に接続される制御配線6が、導体層3及び導体層4の方向D1と逆の方向D2の外側に引き出され、導体層3及び導体層4の外側に位置する制御端子8と接続される。制御端子8の端部8aは、正極端子3a及び負極端子4aと並設される。正極端子3aから負極端子4aに流れる主電流9bの電磁界による制御端子8に流れる制御電流9aへの影響を抑え、半導体素子2の制御性を高める。【選択図】図1
Bibliography:Application Number: JP20190227707