SEMICONDUCTOR DEVICE

• Main Authors: ODA TAKAMASA, FURUKAWA MASARU, MORI TAKURO, SAEKI SEIJI
• Format: Patent
• Language: English; Japanese
• Published: 24.06.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a technique that, when a resin case housing a semiconductor element is fixed to a heat dissipation component with a bolt, can relieve the stress generated around an attachment hole of the resin case.SOLUTION: A semiconductor device 100 includes a base plate 1, a heat dissipation component 13 disposed on a lower surface of the base plate 1, and a resin case 2 disposed on an upper surface of the base plate 1 and having a rectangular shape in a plan view in which a semiconductor element is housed. The resin case 2 is attached to the heat dissipation component 13 with a bolt 10 in a state where the resin case 2 is disposed on the heat dissipation component 13 through the base plate 1. The resin case 2 includes a concave part 3 that is formed at a corner part and houses a head part of the bolt 10, an attachment hole 4 that is formed below the concave part 3 and has a shaft part of the bolt 10 inserted therethrough, and at least one groove part 6 formed between the attachment hole 4 and a wall part 5 on an inner peripheral side that forms the concave part 3. One end of the groove part 6 reaches an outer peripheral end of the resin case 2.SELECTED DRAWING: Figure 1 【課題】半導体素子が収容された樹脂ケースをボルトで放熱部品に固定する際に、樹脂ケースの取付用穴の周辺に発生する応力を緩和することが可能な技術を提供することを目的とする。【解決手段】半導体装置１００は、ベース板１と、ベース板１の下面に配置された放熱部品１３と、ベース板１の上面に配置され、半導体素子を収容する平面視にて矩形状の樹脂ケース２とを備える。樹脂ケース２は、ベース板１を介して放熱部品１３に配置された状態で、放熱部品１３にボルト１０で取り付けられる。樹脂ケース２は、角部に形成されかつボルト１０の頭部が収容される凹部３と、凹部３の下側に形成されかつボルト１０の軸部が挿通される取付用穴４と、凹部３を形成する内周側の壁部５と取付用穴４との間に形成された少なくとも１つの溝部６とを備える。溝部６の一端は樹脂ケース２の外周端に達している。【選択図】図１