SEMICONDUCTOR PROCESS SHEET

• Main Authors: SATO KEI, SHIGA GOSHI
• Format: Patent
• Language: English; Japanese
• Published: 24.06.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; SEMICONDUCTOR DEVICES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

To provide a semiconductor process sheet suitable for efficiently manufacturing semiconductor packages in which the movement and warping of semiconductor chips are suppressed.SOLUTION: The semiconductor process sheet X has a double-sided adhesive sheet 10 and a thermosetting resin layer 20. The doub...